文章摘要
引用本文:朱恒静.航天器用高性能塑封器件的板级鉴定方法[J].航天器环境工程,2008,25(1):87-90 本文二维码信息
二维码(扫一下试试看!)
航天器用高性能塑封器件的板级鉴定方法
Board-level testing for advanced PEMs in space applications
投稿时间:2007-10-30  
DOI:
中文关键词:  板级试验  塑封器件  鉴定  故障覆盖率
English Keywords:board-level test  plastic packaging components  qualification  fault coverage
基金项目:
作者单位
朱恒静 中国空间技术研究院电子元器件可靠性中心 
摘要点击次数: 24321
全文下载次数: 23210
中文摘要:
      由于技术进步和设计需要,航天应用中不可避免地会遇到选用低质量等级塑封器件的情况。随着器件功能的日益复杂和封装的多样化,实现器件级的鉴定越来越困难。文章提出了基于板级系统对塑封器件进行鉴定的方法,包括几个标准的评估方面,如器件级筛选、破坏性物理分析、特殊的设计评估等;并介绍了一种基于局部加热技术,能够考核器件热温度特性的板级评估方法。
English Summary:
      During the technological development and design, it is inevitable that one has to use some available components not very reliable for space applications. Due to the complicity of the component’s functions and the variety of device’s packaging, the component level testing is getting more and more difficult. The suggested qualification system in this paper is based on board-level functional testing of the parts and includes several standard elements of the qualification system, such as the destructive physical analysis (DPA), special design evaluations, and innovative qualification methods. An example of monitoring temperature transients and based on the local heating technique is described.
查看全文  查看/发表评论  下载PDF阅读器